IEC&A "The Electrical and Electronic Experts"
Investigative Engineering Consultants and Associates

IEC & Associates provides Electrical and Electronic Forensic and Investigative Engineering, Patent Infringement Analysis, Claim Chart Mapping, Reverse Engineering, Product Teardowns, Design Engineering, Failure Analysis, and Expert Witness Services for Attorneys, Insurance Companies, Industry and Government. We specialize in electrical and electronic systems, products and devices. Issues addressed include all aspects of the product or system under review or investigation, including design, fabrication, production, operation, failure analysis, reverse engineering, environmental conditions, agency compliance, safety, and product testing of electrical and electronic systems, products and devices as well as computer systems, hardware and software.

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We specialize in Forensic & Investigative Engineering, Patent Infringement Analysis and Expert Witness Services in the areas of Electrical & Electronic Systems, Products and Devices.

Bill Knapp - Principal Semiconductor and Technology Consultant

G. William (Bill) Knapp, Semiconductor Consultant
Technology/Product Development, Methodology, Reverse Engineering & Failure Analysis 


Bill has worked over thirty years developing high technology semiconductor products for consumer, computer, telecommunication, military and medical markets using CMOS, BI-CMOS and Bipolar technologies. He holds five patents and is the author of several papers and publications dealing with integrated circuit design techniques and design firsts. During his career, he has received several employer presidential awards for technical contribution and management.   


In his most recent role, Bill served as SVP Engineering Broadband Access from 2006-2010 at Ikanos/Conexant, where he was responsible for Product Portfolio Management, Product/IP Design and Development (VLSI, AMS (High Speed and Power Management), Custom DSP (High Speed/Low Power), Software, Firmware, Hardware and System Engineering. During his tenure, six new xDSL products for Central Office, Customer Premise and Residential Gateway markets and three new network products (Gb Packet Switch, 2.5G Network Processor and EPON/GPON ONU) were developed. He led the first implementations in 90nm and 65 nm CMOS technology enabling the integration of voice, wireless, SERDES (1.25-5G) and 10/100/1000 Ethernet.    


He served as VP of Product Development from 2003-2006 and interim CEO (2004-2005) at Ziptronix, an early stage 3D-IC company, where he developed the first 3D SoC prototype with 2B+ transistors (fully functional), establishing a $50M revenue forecast. Prior to joining Ziptronix, he served as Vice President Nortel Networks Microelectronics Division from 1998-2001 and held VP product development positions at Vitesse Semiconductor (2001-2002) and Mindspeed Technologies in 2003. 

He worked at Nortel Networks for sixteen years assuming increasing responsibility for the technology, people and business over his tenure.  Upon his departure, the Microelectronics division developed 64 products per year using Foundry, ASIC and Custom flows in CMOS, SiGe and Bipolar technologies.  The products ranged from high volume 1M units per year to complex digital devices nearly 10M gates complexity.   He managed a portfolio consisting of analog, mixed signal and digital devices from concept through end of life.  The organization consisted of 350 people located in the US, Canada and UK, and operated on a budget of $70M. The business unit generated in excess of $900M revenue in 2000. He also served as part of the Acquisition, Investment and Divestiture team.  


His team developed the underlying technology for Nortel Flagship Products in Switching (DMS100/100), Multiservices (Passport 7000/15000), Core Switching (XA-CORE) and METRO-CORE (Optera–Core). As well as introduced groundbreaking Cable Modem, DSL and Line Card Wireless and Opto-electronics technology over his tenure.


Prior to joining Nortel Networks he was with General Electric Semiconductor involved in the development of standard cell and gate array products for commercial, industrial and defense markets from 1981 through 1986.  From 1976 through 1981, he worked with NCR to develop the embedded technology for UPC scanners, Retail and Hospitality systems.


He received his MS in solid-state Physics (Minor in Adv Computer Architectures) from North Carolina State University in 1984 and his BSEE in Integrated Circuit Design and Fabrication (Minor in Analog Design) in 1975 from the University of Cincinnati.